ATS-01A-151-C2-R0
AI

The part number **ATS-01A-151-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series, designed for cooling electronic components such as CPUs, GPUs, or power modules.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm |
| **Thermal Resistance** | 3.93°C/W @ 200 LFM (Airflow) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Interface Material** | T766 (High performance) |
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### 2. Design Components
The part is engineered with specific electronic cooling technologies:
* **Fins:** It features a **Straight Fin** design, which is optimized for high-velocity airflow environments.
* **pushPIN™ Attachment:** This is a hardware-based mounting system that provides a specific pressure (preload) on the chip to ensure maximum thermal transfer. It replaces adhesives or clips that might degrade over time.
* **Thermal Interface Material (TIM):** The "C2" designation typically indicates that a specific high-thermal-conductivity material is pre-applied to the base, ensuring there are no air gaps between the component and the heat sink.
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### 3. Part Number Decoder
Understanding the "R0" and "C2" codes helps in identifying the exact variant:
| Segment | Meaning |
| :--- | :--- |
| **ATS-01** | Series designation (Standard heat sink series) |
| **151** | Dimensional code for 35x35mm footprint |
| **C2** | Thermal Interface Material (Pre-applied) |
| **R0** | RoHS compliance and revision status |
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### 4. Applications
This part is commonly used in:
1. **Telecommunications:** Cooling of high-speed processors in switches/routers.
2. **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical.
3. **Power Electronics:** Cooling FETs or voltage regulators in power supplies.
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- ⤷
What are the different types of pushPIN attachments available for this series?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Is this heat sink compatible with standard BGA or LGA footprints?