công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-01A-151-C2-R0

  • AI
    The part number **ATS-01A-151-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series, designed for cooling electronic components such as CPUs, GPUs, or power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Thermal Resistance** | 3.93°C/W @ 200 LFM (Airflow) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Design Components The part is engineered with specific electronic cooling technologies: * **Fins:** It features a **Straight Fin** design, which is optimized for high-velocity airflow environments. * **pushPIN™ Attachment:** This is a hardware-based mounting system that provides a specific pressure (preload) on the chip to ensure maximum thermal transfer. It replaces adhesives or clips that might degrade over time. * **Thermal Interface Material (TIM):** The "C2" designation typically indicates that a specific high-thermal-conductivity material is pre-applied to the base, ensuring there are no air gaps between the component and the heat sink. --- ### 3. Part Number Decoder Understanding the "R0" and "C2" codes helps in identifying the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS-01** | Series designation (Standard heat sink series) | | **151** | Dimensional code for 35x35mm footprint | | **C2** | Thermal Interface Material (Pre-applied) | | **R0** | RoHS compliance and revision status | --- ### 4. Applications This part is commonly used in: 1. **Telecommunications:** Cooling of high-speed processors in switches/routers. 2. **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. 3. **Power Electronics:** Cooling FETs or voltage regulators in power supplies. ---
    ✨ Follow-up Questions
    • ⤷ What are the different types of pushPIN attachments available for this series?
    • ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
    • ⤷ Is this heat sink compatible with standard BGA or LGA footprints?