## Technical Overview: A-DFF25LPIII-FP-R The **A-DFF25LPIII-FP-R** is a specific variant of a **D-Subminiature (D-Sub)** connector. Based on standard industry nomenclature (specifically referencing Assmann WSW Components naming conventions), this part is a high-density, low-profile female connector designed for PCB mounting. --- ### 1. Key Technical Specifications | Feature | Specification Details | | :--- | :--- | | **Connector Type** | D-Subminiature | | **Gender** | Female (Socket) | | **Number of Positions** | 25 Pins | | **Mounting Type** | Through-Hole, Right Angle | | **Profile** | Low Profile (LP) | | **Contact Plating** | Flash Gold (or Selective Gold) | | **Shell Material** | Tin-plated Steel | | **Orientation** | Horizontal (Right Angle to PCB) | --- ### 2. Part Number Breakdown Understanding the suffix and prefix helps identify the specific electronic characteristics: * **A**: Usually denotes the manufacturer series (Assmann). * **DFF**: **D**-Sub, **F**emale, **F**ront Riveted (or specific footprint style). * **25**: The pin count (standard 25-pin density). * **LP**: **L**ow **P**rofile. This reduces the physical height of the connector on the PCB, saving vertical space in tight enclosures. * **III**: Design generation or specific mounting hole spacing/offset. * **FP**: **F**ull **P**lastic or **F**astener **P**in (often refers to the mounting hardware/threaded inserts). * **R**: **R**oHS Compliant. --- ### 3. Electronic & Mechanical Characteristics #### A. Electrical Performance * **Current Rating:** Typically 1A to 3A per contact. * **Dielectric Withstanding Voltage:** Usually 500V AC to 1000V AC for 1 minute. * **Insulation Resistance:** $\ge$ 1000 M$\Omega$ at 500V DC. * **Contact Resistance:** $\le$ 20 m$\Omega$ (initial). #### B. Physical Construction * **Insulator:** Thermoplastic (typically UL94V-0 rated PBT). * **Contacts:** Copper alloy. The "FP" designation often implies the presence of a "Friction Plate" or specific board locks that provide mechanical stability during soldering. * **Shielding:** The metal shell provides EMI/RFI protection when grounded to the chassis or PCB ground plane. --- ### 4. Common Applications Due to the **Right Angle Low Profile** nature, this part is commonly found in: * **Industrial Automation:** PLC communication ports. * **Networking:** Legacy router/switch console ports. * **Embedded Systems:** Space-constrained motherboards where height is limited. * **Testing Equipment:** Interface ports for diagnostic tools.