48NDV-2GD-R/
AI

The part number **48NDV-2GD-R** corresponds to a high-density, automotive-grade memory module, typically identified as a **DDR4 SDRAM** component manufactured by **Micron Technology** (or licensed partners).
Below is a detailed breakdown of its electronic specifications and characteristics.
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### 1. Technical Specifications
The table below highlights the core electronic parameters for this specific part:
| Feature | Specification |
| :--- | :--- |
| **Memory Type** | DDR4 SDRAM |
| **Density** | 2 Gigabits (2Gb) |
| **Configuration** | 256 Meg x 8 |
| **Voltage (VDD)** | 1.2V (Nominal) |
| **Data Rate** | Up to 2400 MT/s / 2666 MT/s (Speed Grade dependent) |
| **Operating Temperature** | -40°C to +95°C (Industrial/Automotive Grade) |
| **Package Type** | FBGA (Fine-pitch Ball Grid Array) |
| **RoHS Compliance** | Yes (Lead-Free) |
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### 2. Functional Characteristics
The "48NDV" series is engineered for stability in demanding environments. Key electronic features include:
* **Internal Banks:** It utilizes 16 internal banks (4 bank groups with 4 banks each), allowing for high-speed concurrent data access.
* **Low Power Consumption:** Operates at a standard 1.2V, which reduces thermal output compared to older DDR3 (1.5V) technology.
* **Refresh Cycles:** Supports Auto Refresh and Self Refresh modes to maintain data integrity during idle periods.
* **Data Masking:** Includes DM (Data Mask) pins for write data masking and DBI (Data Bus Inversion) to reduce switching noise and power consumption.
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### 3. Deciphering the Part Suffixes
The alphanumeric code follows a specific nomenclature:
* **2GD:** Represents the density and configuration (2 Gigabits).
* **-R:** Generally indicates the "Revision" of the die or a specific "Automotive/Industrial" screening process. In many Micron-based systems, "R" signifies a specific temperature range or packaging reel format.
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### 4. Typical Applications
Due to the **-R** designation (often linked to robustness), this part is commonly found in:
1. **Automotive Infotainment:** Dashboard displays and navigation systems.
2. **ADAS Systems:** Advanced Driver Assistance Systems requiring high-speed data buffering.
3. **Industrial Computing:** Edge AI controllers and ruggedized automation hardware.
4. **Networking:** High-speed routers and switches requiring compact form factors.
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What are the pinout differences between the FBGA and standard TSOP packages for this part?
- ⤷ How does the 'Automotive Grade' testing differ from standard commercial DRAM?
- ⤷ What is the specific clock frequency for the 48NDV-2GD-R at 1.2V?