The part number **252010CDMCCDS-R33MC** refers to a high-performance **Power Inductor** manufactured by **Sumida**. This component is specifically designed for surface-mount technology (SMT) and is commonly used in DC-DC converters and power supply modules. ### Component Breakdown The alphanumeric code follows Sumida's standard naming convention for the CDMC series: | Segment | Meaning | Description | | :--- | :--- | :--- | | **252010** | Case Size | Dimensions are approx. 2.5mm x 2.0mm x 1.0mm. | | **CDMC** | Series | Low-profile, high-current power inductor series. | | **CDS** | Construction | Typically denotes the internal structure/shielding style. | | **R33** | Inductance | **0.33 µH** (Microhenries). | | **M** | Tolerance | **±20%** (standard for power inductors). | | **C** | Packaging | Reel/Carrier tape specification. | --- ### Technical Specifications Based on the standard 252010 size profile for this series, the typical electrical characteristics are as follows: * **Inductance:** 0.33 µH * **DC Resistance (DCR):** Extremely low, usually in the range of 15mΩ to 25mΩ to minimize power loss. * **Saturation Current (Isat):** The current level where inductance drops by a specific percentage (e.g., 30%). For this size, it typically handles 4.5A to 6.0A. * **Temperature Rise Current (Irms):** The current that causes a 40°C temperature rise, usually around 4.0A to 5.5A. * **Operating Temperature:** -40°C to +125°C (including self-heating). --- ### Key Features 1. **Metal Compound Core:** Uses a metal powder molding technology which provides high saturation current characteristics compared to traditional ferrite cores. 2. **Magnetic Shielding:** The molded construction naturally shields the component, reducing Electromagnetic Interference (EMI) with surrounding components. 3. **Low Profile:** At only 1.0mm height, it is ideal for thin electronic devices like smartphones, tablets, and wearable tech. 4. **High Efficiency:** Low DCR ensures minimal energy is wasted as heat, extending battery life in portable devices. ### Typical Applications * **Smartphones & Tablets:** Point-of-Load (POL) converters for CPUs and GPUs. * **SSD/Storage:** Power management for high-speed data drives. * **IoT Devices:** Compact power regulation for sensors and wireless modules. * **VR/AR Headsets:** High-density power circuitry where space is premium. ---