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Molex Electronics Ltd. |
0879331007
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355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
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0879331211
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355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
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0879331215
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355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
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0879331217
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355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76關m (30關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
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0879332415
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71Kb/2P |
Slim-Grid Board-to-Board Connectors
07/27/2018 |
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0879333015
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355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
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0879335031
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174Kb/4P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120)
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0879370106
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102Kb/3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
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0879370406
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102Kb/3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
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0879370502
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102Kb/3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
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0879370600
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194Kb/4P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 6 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
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0879370800
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194Kb/4P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 12.00mm (.472) Stacking Height
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0879370801
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194Kb/4P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
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0879370802
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102Kb/3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
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0879371206
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102Kb/3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
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0879371600
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195Kb/4P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height
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0879371601
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195Kb/4P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 19.05mm (.750) Stacking Height
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0879380002
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163Kb/4P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Single Row Dual Body, Vertical, 8 Circuits, Gold (Au) Selective Plating, 8.07mm (.318) Stacking Height
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0879390001
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103Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
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0879392000
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333Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50關m (100關) Tin (Sn) Plating, 15.35mm(.604) Stacking Height
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