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Molex Electronics Ltd. |
0015801341
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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0015801321
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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0015801321-ND
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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0015801324
|
31Kb/2P |
2.54mm Pitch C-Grid짰 Header
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0015801361
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
0015801361-ND
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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|
0015801061
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
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0015801101
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
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0015801121
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
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|
0015801123
|
32Kb/2P |
2.54mm Pitch C-Grid짰 Header
|
|
0015801143
|
32Kb/2P |
2.54mm Pitch C-Grid짰 Header
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|
0015801161
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
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|
0015801163
|
31Kb/2P |
2.54mm Pitch C-Grid짰 Header
|
|
0015801181
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
0015801181-ND
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
0015801201
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
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|
0015801221
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
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|
0015801241
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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|
0015801241-ND
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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|
0015801261
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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