| nhà sản xuất | tên linh kiện | bảng dữ liệu | Giải thích chi tiết về linh kiện |
HARTING Technology Grou... |
09-30-010-1221
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548Kb/2P
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Han B Base Surface LC 4 Pegs Thermoplast Surface mounted housing
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API Delevan |
100-122K
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233Kb/1P
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Micro i Ribbon-Lead Inductors
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100-122K
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1Mb/1P
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Micro i짰 Ribbon-Lead Inductors
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List of Unclassifed Man... |
1120-122K
|
38Kb/1P
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HIGH CURRENT RF CHOKES
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Bourns Electronic Solut... |
1120-122K-RC
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432Kb/1P
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Very high current capacity
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1130-122K-RC
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475Kb/1P
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High Current Chokes Very high current capacity Fixed lead spacing
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1140-122K-RC
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434Kb/1P
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Very high current capacity Low DCR
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List of Unclassifed Man... |
1210-122J
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50Kb/2P
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Surface Mount Inductors
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Molex Electronics Ltd. |
14-60-1220
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169Kb/3P
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2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 26, 3.81關m (150關") Tin/Lead (SnPb)
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14-60-1221
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171Kb/3P
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2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 3.81關m (150關") Tin/Lead (SnPb)
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14-60-1222
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168Kb/3P
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2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 28, 3.81關m (150關") Tin/Lead (SnPb)
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15-80-1221
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40Kb/2P
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2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
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15-80-1221
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1Mb/7P
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2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
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15020-1220
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73Kb/1P
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1.00mm Pitch Premo-Flex FFC Jumper
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15020-1221
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73Kb/1P
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1.00mm Pitch Premo-Flex FFC Jumper
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15020-1222
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73Kb/1P
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1.00mm Pitch Premo-Flex FFC Jumper
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15020-1223
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73Kb/1P
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1.00mm Pitch Premo-Flex FFC Jumper
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15020-1224
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73Kb/1P
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1.00mm Pitch Premo-Flex FFC Jumper
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15020-1225
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73Kb/1P
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1.00mm Pitch Premo-Flex FFC Jumper
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15020-1226
|
73Kb/1P
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1.00mm Pitch Premo-Flex FFC Jumper
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