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ST72361AR4-Auto bảng dữ liệu(PDF) 259 Page - STMicroelectronics

tên linh kiện ST72361AR4-Auto
Giải thích chi tiết về linh kiện  Clock, reset and supply management
PDF  279 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72361AR4-Auto bảng dữ liệu(HTML) 259 Page - STMicroelectronics

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ST72361xx-Auto
Package characteristics
Doc ID 12468 Rev 3
259/279
20.3
Thermal characteristics
20.4
Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in Figure 127.
Figure 127. pin 1 orientation in tape and reel conditioning
See also Figure 128: ST72F361xx-Auto Flash commercial product structure on page 264
and Figure 129: ST72P361xxx-Auto FastROM commercial product structure on page 265.
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to
ambient)
LQFP64
LQFP44
LQFP32
60
52
70
°C/W
PD
Power dissipation(1)
1.
The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation
of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip
internal power (IDD xVDD) and PPORT is the port power dissipation depending on the ports used in the
application.
500
mW
TJmax
Maximum junction temperature(2)
2.
The maximum chip-junction temperature is based on technology characteristics.
150
°C
Right orientation (EIA 481-C compliant)
Left orientation
Pin 1
Pin 1



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