MB91F587LD datasheet(173/177 Pages) SPANSION

tên linh kiện	MB91F587LD

Giải thích chi tiết về linh kiện	This document states the current technical specifications regarding

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D at aS h ee t

170

MB91F587LA_DS705-00012-2v0-E, August 22, 2014

CONFIDENTIAL



PACKAGE DIMENSIONS

144-pin plastic LQFP

Lead pitch

0.50 mm

Package width

package length

20.0

× 20.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

1.20 g

Code

(Reference)

P-LFQFP144-20

×20-0.50

144-pin plastic LQFP

(FPT-144P-M08)

2003-2010 FUJITSU SEMICONDUCTOR LIMITED F144019S-c-4-8

Details of "A" part

0.25(.010)

(Stand off)

(.004±.004)

0.10±0.10

(.024±.006)

0.60±0.15

(.020±.008)

0.50±0.20

1.50

+0.20

–0.10

+.008

–.004

.059

0°~8°

0.50(.020)

"A"

0.08(.003)

0.145±0.055

(.006±.002)

LEAD No. 1

INDEX

108

109

144

0.22±0.05

(.009±.002)

0.08(.003)

22.00±0.20(.866±.008)SQ

(Mounting height)

* 20.00±0.10(.787±.004)SQ

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) *:Values do not include resin protrusion.

Resin protrusion is +0.25(.010)Max(each side).

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

Please check the latest package dimension at the following URL.

http://edevice.fujitsu.com/package/en-search/

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