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PIC24HJ128GP310 bảng dữ liệu(PDF) 274 Page - Microchip Technology

tên linh kiện PIC24HJ128GP310
Giải thích chi tiết về linh kiện  High-Performance, 16-Bit Microcontrollers
PDF  286 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC24HJ128GP310 bảng dữ liệu(HTML) 274 Page - Microchip Technology

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PIC24HJXXXGPX06/X08/X10
DS70175F-page 272
© 2007 Microchip Technology Inc.
24.2
Package Details
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
64
Lead Pitch
e
0.50 BSC
Overall Height
A
–
–
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
7°
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
D
D1
E
E1
e
b
N
NOTE 1
12 3
NOTE 2
c
L
A1
L1
A2
A
φ
β
α
Microchip Technology Drawing C04-085B



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