PIC18F2680ISPQTP datasheet(460/482 Pages) MICROCHIP

460 / 482 page

PIC18F2585/2680/4585/4680

DS39625C-page 458

Preliminary

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Leads

Lead Pitch

0.80 BSC

Overall Height

–

1.20

Molded Package Thickness

0.95

1.00

1.05

Standoff

0.05

–

0.15

Foot Length

0.45

0.60

0.75

Footprint

1.00 REF

Foot Angle

0°

3.5°

7°

Overall Width

12.00 BSC

Overall Length

12.00 BSC

Molded Package Width

10.00 BSC

Molded Package Length

10.00 BSC

Lead Thickness

0.09

–

0.20

Lead Width

0.30

0.37

0.45

Mold Draft Angle Top

11°

12°

13°

Mold Draft Angle Bottom

11°

12°

13°

NOTE 1

NOTE 2

12 3

Microchip Technology Drawing C04-076B

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