DSPIC33FJ06GS101TESLASHML datasheet(285/346 Pages) MICROCHIP

285 / 346 page

Preliminary

DS70318D-page 283

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04

24.0

ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 electrical characteristics.

Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 family are listed below.

Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of

the device at these or any other conditions above the parameters indicated in the operation listings of this specification

is not implied.

Absolute Maximum Ratings(1)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V)

Voltage on any digital-only pin with respect to VSS .................................................................................. -0.3V to +5.6V

Voltage on VCAP/VDDCORE with respect to VSS ...................................................................................... 2.25V to 2.75V

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin(2)...........................................................................................................................250 mA

Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA

Maximum output current sourced by any I/O pin(3)...................................................................................................4 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports(2)...............................................................................................................200 mA

Maximum output current sunk by non-remappable PWM pins ...............................................................................16 mA

Maximum output current sourced by non-remappable PWM pins ..........................................................................16 mA

Note 1:

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods may affect device reliability.

Maximum allowable current is a function of device maximum power dissipation (see Table 24-2).

Exceptions are PWMxL, and PWMxH, which are able to sink/source 16 mA, and digital pins, which are able

to sink/source 8 mA.

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