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PIC12CE673 bảng dữ liệu(PDF) 118 Page - Microchip Technology |
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PIC12CE673 bảng dữ liệu(HTML) 118 Page - Microchip Technology |
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118 / 130 page ![]() PIC12C67X DS30561C-page 118 1997-2013 Microchip Technology Inc. 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil 7.11 6.86 6.60 .280 .270 .260 U Lid Width 11.68 11.43 11.18 .460 .450 .440 T Lid Length 4.34 4.22 4.09 .171 .166 .161 W Window Diameter 8.23 7.87 7.52 .324 .310 .296 eB Overall Row Spacing 0.51 0.46 0.41 .020 .018 .016 B Lower Lead Width 1.52 1.40 1.27 .060 .055 .050 B1 Upper Lead Width 0.30 0.25 0.20 .012 .010 .008 c Lead Thickness 3.81 3.56 3.30 .150 .140 .130 L Tip to Seating Plane 13.46 13.21 12.95 .530 .520 .510 D Overall Length 7.62 7.37 7.11 .300 .290 .280 E1 Package Width 1.14 0.89 0.64 .045 .035 .025 A1 Standoff 3.63 3.12 2.62 .143 .123 .103 A2 Top of Body to Seating Plane 4.70 4.19 3.68 .185 .165 .145 A Top to Seating Plane 2.54 .100 p Pitch 8 8 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units 2 1 D n T E1 U W c eB L A2 B B1 A A1 p *Controlling Parameter JEDC Equivalent: MS-015 Drawing No. C04-083 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging |
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