PIC16F616-HSLASHML datasheet(197/214 Pages) MICROCHIP

197 / 214 page

DS41288F-page 197

PIC16F610/616/16HV610/616

17.0

PACKAGING INFORMATION

17.1

Package Marking Information

Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability

code. For PIC® device marking beyond this, certain price adders apply. Please check with your

Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

14-Lead PDIP

XXXXXXXXXXXXXX

YYWWNNN

Example

PIC16F616

0610017

14-Lead SOIC (.150”)

XXXXXXXXXXX

YYWWNNN

Example

PIC16F616-E

0610017

14-Lead TSSOP

XXXXXXXX

YYWW

NNN

Example

XXXX/ST

0610

017

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

XXXXXXX

16-Lead QFN

XXXXXXX

YYWWNNN

16F616

Example

-I/ML

0610017

-I/P

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