PIC12F615-ESLASHMS datasheet(195/212 Pages) MICROCHIP

195 / 212 page

 2010 Microchip Technology Inc.

DS41302D-page 195

PIC12F609/615/617/12HV609/615

18.0

PACKAGING INFORMATION

18.1

Package Marking Information

Standard PIC device marking consists of Microchip part number, year code, week code, and traceability code. For

PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP

devices, any special marking adders are included in QTP price.

Legend:

XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will be

carried over to the next line, thus limiting the number of available characters for

customer-specific information.

XXXXXNNN

8-Lead PDIP (.300”)

XXXXXXXX

YYWW

017

Example

XXFXXX/P

0610

8-Lead SOIC (.150”)

XXXXXXXX

XXXXYYWW

NNN

Example

PICXXCXX

/SN0610

017

XXXXXX

8-Lead DFN (4x4 mm) (for PIC12F609/615/HV609/615

YYWW

NNN

Example

XXXXXX

0610

017

XXXX 3

8-Lead MSOP

XXXXXX

YWWNNN

Example

602/MS

610017

XXXX

8-Lead DFN (3x3 mm)

YYWW

NNN

Example

0610

017

XXXX

devices only)

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