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STM32L443CC bảng dữ liệu(PDF) 206 Page - STMicroelectronics |
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STM32L443CC bảng dữ liệu(HTML) 206 Page - STMicroelectronics |
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206 / 215 page ![]() Package information STM32L443CC STM32L443RC STM32L443VC 206/215 DS11421 Rev 4 from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. 7.8 UFQFPN48 package information Figure 63. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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