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SPC58EG80C3 bảng dữ liệu(PDF) 103 Page - STMicroelectronics

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SPC58EG80C3 bảng dữ liệu(HTML) 103 Page - STMicroelectronics

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DS11758 Rev 6
103/139
SPC584Gx, SPC58EGx, SPC58NGx
Electrical characteristics
106
Figure 43. TxD Signal propagation delays
4.17.4.3
RxD
Table 58. TxD output characteristics
Symbol
C
Characteristic(1),(2)
Value
Unit
Min
Max
dCCTxAsym
CC D
Asymmetry of sending CC at 25 pF load
(= dCCTxD50% − 100 ns)
–2.45
2.45
ns
dCCTxDRISE25+dCCTxDFALL25 CC
D Sum of Rise and Fall time of TxD signal at the
output pin(3)
—9(4)
ns
D—
9(5)
dCCTxD01
CC D
Sum of delay between Clk to Q of the last FF
and the final output buffer, rising edge
—25
ns
dCCTxD10
CC D
Sum of delay between Clk to Q of the last FF
and the final output buffer, falling edge
—25
ns
1. TxD pin load maximum 25 pF.
2. Pad configured as VERY STRONG.
3. Sum of transition time simulation is performed according to Electrical Physical Layer Specification 3.0.1 and the entire
temperature range of the device has been taken into account.
4. VDD_HV_IO = 5.0 V ± 10%, Transmission line Z = 50 ohms, tdelay = 1 ns, CL = 10 pF.
5. VDD_HV_IO = 3.3 V ± 10%, Transmission line Z = 50 ohms, tdelay = 0.6 ns, CL = 10 pF.
dCCTxD10
dCCTxD01
TxD
PE_Clk
*
* FlexRay Protocol Engine Clock
Table 59. RxD input characteristics
Symbol
C
Characteristic
Value
Unit
Min
Max
C_CCRxD
CC D Input capacitance on RxD pin
—
7
pF
uCCLogic_1
CC D Threshold for detecting logic high
35
70
%



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