STM32L151VD datasheet(152/154 Pages) STMICROELECTRONICS

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Revision History

STM32L151xD STM32L152xD

152/154

DocID022027 Rev 11

07-Apr-2014

(continued)

Updated Figure 28: I2C bus AC waveforms and measurement circuit.

Updated “SDA data hold time” and “SDA and SCL rise time” values

and added “Pulse width of spikes that are suppressed by the analog

filter” row in Table 55: I2C characteristics.

Updated Table 64: ADC characteristics and Table 65: ADC accuracy.

Updated Table 67: DAC characteristics.

Updated Table 69: Temperature sensor calibration values and moved

inside Section 6.3.22: Temperature sensor characteristics. Removed

note 4 in Table 70: Temperature sensor characteristics.

Updated Table 76: LQFP64, 10 x 10 mm 64-pin low-profile quad flat

package mechanical data and Table 77: UFBGA132, 7 x 7 mm, 132-

ball ultra thin, fine-pitch ball grid array package mechanical data.

Updated Section 8: Part numbering (title).

Added Table 50: UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch

ball grid array package recommended footprint..

23-Oct-2014

Updated Section 3.18: Communication interfaces putting I2S

characteristics inside.

Updated DMIPS features in cover page and Section 2: Description.

Updated max temperature at 105°C instead of 85°C in the whole

datasheet.

Updated currents consumption in Table 19: Current consumption in

Sleep mode.

Updated Table 24: Peripheral current consumption with new measured

current values.

Updated Table 66: Maximum source impedance RAIN max adding

note 2.

04-Feb-2015

Updated Section 7: Package information with new package device

marking.

Updated Figure 8: Memory map.

Table 82. Document revision history (continued)

Date

Revision

Changes

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