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STM32L151VD bảng dữ liệu(PDF) 143 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  Ultra-low-power 32-bit MCU ARM® Cortex®-M3, 384KB Flash, 48KB SRAM, 12KB EEPROM, LCD, USB, ADC, DAC, memory I/F
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STM32L151VD bảng dữ liệu(HTML) 143 Page - STMicroelectronics

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STM32L151xD STM32L152xD
Package information
153
Figure 53. WLCSP64, 0.4 mm pitch wafer level chip scale package
recommended footprint
b(2)
0.240
0.270
0.300
0.0094
0.0106
0.0118
D
4.504
4.539
4.574
0.1773
0.1787
0.1801
E
4.876
4.911
4.946
0.1920
0.1933
0.1947
e
-
0.400
-
-
0.0157
-
e1
-
2.800
-
-
0.1102
-
F
-
0.870
-
-
0.0343
-
G
-
1.056
-
-
0.0416
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 79. WLCSP64, 0.4 mm pitch package recommended PCB design rules
Dimension
Recommended values
Pitch
0.4
Dpad
260 µm max. (circular)
220 µm recommended
Dsm
300 µm min. (for 260 µm diameter pad)
PCB pad design
Non-solder mask defined via underbump allowed.
Table 78. WLCSP64, 0.4 mm pitch wafer level chip scale package mechanical data
(continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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