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LSF0108 bảng dữ liệu(PDF) 210 Page - Nexperia B.V. All rights reserved

tên linh kiện LSF0108
Giải thích chi tiết về linh kiện  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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nhà sản xuất  NEXPERIA [Nexperia B.V. All rights reserved]
Trang chủ  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 bảng dữ liệu(HTML) 210 Page - Nexperia B.V. All rights reserved

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Nexperia selection guide 2020
210
Minimized outline drawings and reflow soldering footprint
8-pin SMD packages
Dimensions in mm
Images are for reference only, for detailed drawings please visit nexperia.com/packages
TSSOP8 (SOT505-2)
TSSOP8 (SOT505-2)
14-10-01
Dimensions in mm
14
8
5
0.47
0.33
1.1
max
0.18
0.08
3.1
2.9
4.1
3.9
3.1
2.9
0.38
0.22
0.65
0.15
0.00
SOT505-2
Footprint information for reflow soldering of TSSOP8 package
sot505-2_fr
Issue date 17-12-01
17-12-04
occupied area
solder paste deposit
solder land
solder land plus solder paste
0.4
0.95
0.75
0.85
0.5
0.6
0.3
0.4
0.5
0.125
2.7
4.4
3.6
0.7
0.65
0.7
0.125
2.8
3.6
4.65
SOT505-2
Footprint information for reflow soldering of TSSOP8 package
sot505-2_fr
Issue date 17-12-01
17-12-04
occupied area
solder paste deposit
solder land
solder land plus solder paste
0.4
0.95
0.75
0.85
0.5
0.6
0.3
0.4
0.5
0.125
2.7
4.4
3.6
0.7
0.65
0.7
0.125
2.8
3.6
4.65
LFPAK56D (SOT1205)
Package outline
© 2010 NXP B.V.
All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not
form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights.
Printed in the Netherlands
www.nxp.com
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1205
sot1205_po
13-02-19
13-02-21
Unit
mm
max
nom
min
1.05 0.1
0.0
4.4
4.1
0.25
0.19
0.30
0.24
4.70
4.45
3.5
5.30
4.95
0.85
0.85
0.40
A
Dimensions
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
Plastic single ended surface mounted package (LFPAK56D); 8 leads
SOT1205
A1
b
0.50
0.35
b1
c
c1
D(1)
0.1
8°
0°
y
θ
D1(1)
4.8
D2
(ref) E
(1) E1(1)
1.8
1.6
E2
e
1.27
H
6.2
5.9
L
1.3
0.8
L1
0.55
0.30
Lp
0.25
w
0
2.5
5 mm
scale
detail X
A1 C
Lp
θ
C
y
E2
D2
E1
D1
mounting
base
c
X
A
c1
A
e
b
(8x)
w
A
D
E
H
L
L1
b1
1
2
3
4
LFPAK56D (SOT1205)
Reflow soldering footprint
© 2010 NXP B.V.
All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not
form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights.
Printed in the Netherlands
www.nxp.com
SOT1205
Footprint information for reflow soldering of LFPAK56D package
sot1205_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Reflow soldering footprint
© 2010 NXP B.V.
All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not
form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights.
Printed in the Netherlands
www.nxp.com
1.27
0.7 (4x)
SOT1205
Footprint information for reflow soldering of LFPAK56D package
sot1205_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
5.85
0.8
2.0
1.0 (2x)
2.1
3.2
3.325
2.7
3.85 3.975
1.275
3.175
1.875
0.0625
0.025
3.81
3.81
1.44
1.27
1.1 (2x)
0.7 (4x)
TSSOP8 (SOT530-1)
TSSOP8 (SOT530-1)
Nexperia
SOT530-1
plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body
3. Soldering
SOT530-1
Footprint information for reflow soldering of TSSOP8 package
sot530-1_fr
Issue date 09-12-13
18-10-08
0.125
1.25
1.35
1.45
0.125
3.0
0.65
0.75
3.8
5.3 7.2 7.45
recommended stencil thickness: 0.125 mm
occupied area
solder paste
solder resist
solder land
0.5
0.6
0.7
0.3
0.4
0.5
4.5
Fig. 2. Reflow soldering footprint for TSSOP8 (SOT530-1)
SOT530-1
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
18 October 2018
3 / 5
Nexperia
SOT530-1
plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body
3. Soldering
SOT530-1
Footprint information for reflow soldering of TSSOP8 package
sot530-1_fr
Issue date 09-12-13
18-10-08
0.125
1.25
1.35
1.45
0.125
3.0
0.65
0.75
3.8
5.3 7.2 7.45
recommended stencil thickness: 0.125 mm
occupied area
solder paste
solder resist
solder land
0.5
0.6
0.7
0.3
0.4
0.5
4.5
Fig. 2. Reflow soldering footprint for TSSOP8 (SOT530-1)
SOT530-1
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
18 October 2018
3 / 5
Nexperia
SOT530-1
plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body
2. Package outline
UNIT
A1
A
max.
A2
A3
bp
L
HE
Lp
w
y
v
c
e
D(1)
E(2)
Z(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.85
0.30
0.19
0.20
0.13
3.1
2.9
4.5
4.3
0.65
6.5
6.3
0.70
0.35
8°
0°
0.1
0.1
0.1
0.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.5
SOT530-1
MO-153
00-02-24
03-02-18
w M
bp
D
Z
e
0.25
1
4
8
5
θ
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
v M A
X
A
y
2.5
5 mm
0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
SOT530-1
1.1
pin 1 index
Fig. 1. Package outline TSSOP8 (SOT530-1)
SOT530-1
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
18 October 2018
2 / 5
Nexperia
SOT530-1
plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body
2. Package outline
UNIT
A1
A
max.
A2
A3
bp
L
HE
Lp
w
y
v
c
e
D(1)
E(2)
Z(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.85
0.30
0.19
0.20
0.13
3.1
2.9
4.5
4.3
0.65
6.5
6.3
0.70
0.35
8°
0°
0.1
0.1
0.1
0.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.5
SOT530-1
MO-153
00-02-24
03-02-18
w M
bp
D
Z
e
0.25
1
4
8
5
θ
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
v M A
X
A
y
2.5
5 mm
0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
SOT530-1
1.1
pin 1 index
Fig. 1. Package outline TSSOP8 (SOT530-1)
SOT530-1
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
18 October 2018
2 / 5
XSON8 (SOT996-2)
XSON8 (SOT996-2)
14-09-30
Dimensions in mm
0.5
0.05
0.00
0.6
0.4
3.1
2.9
2.1
1.9
1.5
0.35
0.15
0.5
14
85
0.5
0.3



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