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LSF0108 bảng dữ liệu(PDF) 198 Page - Nexperia B.V. All rights reserved

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Giải thích chi tiết về linh kiện  Discrete and MOSFET components, analog & logic ICs
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nhà sản xuất  NEXPERIA [Nexperia B.V. All rights reserved]
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LSF0108 bảng dữ liệu(HTML) 198 Page - Nexperia B.V. All rights reserved

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Nexperia selection guide 2020
198
Dimensions in mm
Nexperia
SOT404A
plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3
mm body
SOT404A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2017. All rights reserved
Package information
30 January 2017
2 / 5
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT404A
sot404a_po
13-02-28
13-03-12
Unit
mm
max
nom
min
4.5
4.1
1.40
1.27
1.45
1.05
0.64
0.46
11
1.6
1.2
A
Dimensions (mm are the original dimensions)
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404A
A1
b
0.85
0.60
b2
c
Dmax D1
8.6
8.0
1.85
1.40
D2
D3
E
e
HD
Lp
Q
2.54
15.8
14.8
2.6
2.2
10.3
9.7
E1
8.1
7.6
2.9
2.1
scale
5 mm
0
E
E1
e
e
b
b2
Lp
Q
c
A1
A
1
3
2
mounting
base
D1
HD
D
D3
D2
Fig. 1. Package outline D2PAK (SOT404A)
Nexperia
SOT404A
plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3
mm body
SOT404A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2017. All rights reserved
Package information
30 January 2017
2 / 5
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT404A
sot404a_po
13-02-28
13-03-12
Unit
mm
max
nom
min
4.5
4.1
1.40
1.27
1.45
1.05
0.64
0.46
11
1.6
1.2
A
Dimensions (mm are the original dimensions)
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404A
A1
b
0.85
0.60
b2
c
Dmax D1
8.6
8.0
1.85
1.40
D2
D3
E
e
HD
Lp
Q
2.54
15.8
14.8
2.6
2.2
10.3
9.7
E1
8.1
7.6
2.9
2.1
scale
5 mm
0
E
E1
e
e
b
b2
Lp
Q
c
A1
A
1
3
2
mounting
base
D1
HD
D
D3
D2
Fig. 1. Package outline D2PAK (SOT404A)
Nexperia
SOT404A
plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3
mm body
SOT404A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2017. All rights reserved
Package information
30 January 2017
2 / 5
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT404A
sot404a_po
13-02-28
13-03-12
Unit
mm
max
nom
min
4.5
4.1
1.40
1.27
1.45
1.05
0.64
0.46
11
1.6
1.2
A
Dimensions (mm are the original dimensions)
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404A
A1
b
0.85
0.60
b2
c
Dmax D1
8.6
8.0
1.85
1.40
D2
D3
E
e
HD
Lp
Q
2.54
15.8
14.8
2.6
2.2
10.3
9.7
E1
8.1
7.6
2.9
2.1
scale
5 mm
0
E
E1
e
e
b
b2
Lp
Q
c
A1
A
1
3
2
mounting
base
D1
HD
D
D3
D2
Fig. 1. Package outline D2PAK (SOT404A)
D2PAK (SOT404A)
Nexperia
SOT404A
plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3
mm body
SOT404A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2017. All rights reserved
Package information
30 January 2017
3 / 5
3. Soldering
SOT404A
Footprint information for reflow soldering of D2PAK package
sot404a_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
16-09-06
16-09-06
5.40
8.075
2.15
1.50
0.30
3.00
2.25
4.60
8.35
8.15
7.95
4.85
8.275
1.55
0.20
1.30
5.08
1.20
1.70
7.40
7.50
10.50
10.60
1.50
10.85
Fig. 2. Wave soldering footprint for D2PAK (SOT404A)
Nexperia
SOT404A
plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3
mm body
SOT404A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2017. All rights reserved
Package information
30 January 2017
3 / 5
3. Soldering
SOT404A
Footprint information for reflow soldering of D2PAK package
sot404a_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
16-09-06
16-09-06
5.40
8.075
2.15
1.50
0.30
3.00
2.25
4.60
8.35
8.15
7.95
4.85
8.275
1.55
0.20
1.30
5.08
1.20
1.70
7.40
7.50
10.50
10.60
1.50
10.85
Fig. 2. Wave soldering footprint for D2PAK (SOT404A)
D2PAK (SOT404A)
3-pin SMD packages
Minimized outline drawings and reflow soldering footprint
Images are for reference only, for detailed drawings please visit nexperia.com/packages
DPAK (SOT428C)
DPAK (SOT428C)
Nexperia
SOT428C
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT428C
SC-63
TO-252
sot428c_po
19-08-28
Unit
mm
max
nom
min
2.38 0.93
1.10 5.46 0.60 6.22
4.57
1.0
A
Dimensions (mm are the original dimensions)
Note
1. Plastic body may have 45° chamfer.
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
SOT428C
A1
b
0.89
b1
b2
c
D1
D2
E
E1
e
2.285
e1
HD
L
2.95
L1
0.2
L2
w
6.47 4.45
4.0
9.6
2.22 0.46
0.72 5.00 0.20 5.98
0.5
0.71
2.55 0.5
6.73
10.4
0.2
y
0
5
10 mm
scale
A
2
1
3
E1
D2
D1
HD
L
L1
L2
e1
e
mounting
base
w
A
b
(2x)
E
b2
b1
(2x)
c
A1
y
A
see note 1
Fig. 1. Package outline DPAK (SOT428C)
SOT428C
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
23 October 2019
2 / 5
Nexperia
SOT428C
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
3. Soldering
SOT428C
Footprint information for reflow soldering of DPAK (SOT428C) package
sot428c_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
19-09-06
6.15
5.8
5.9
1.8
7
1.3
1.5
1.4
1.65
4.57
6
6.125
4.725
6.5
0.3
1
1.15
5.65
2.3
2.4
2.45
3.6
6
5.75
4.6
Fig. 2. Reflow soldering footprint for DPAK (SOT428C)
SOT428C
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
23 October 2019
3 / 5
Nexperia
SOT428C
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
3. Soldering
SOT428C
Footprint information for reflow soldering of DPAK (SOT428C) package
sot428c_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
19-09-06
6.15
5.8
5.9
1.8
7
1.3
1.5
1.4
1.65
4.57
6
6.125
4.725
6.5
0.3
1
1.15
5.65
2.3
2.4
2.45
3.6
6
5.75
4.6
Fig. 2. Reflow soldering footprint for DPAK (SOT428C)
SOT428C
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
23 October 2019
3 / 5
DFN1010D-3 (SOT1215)
DFN1010D-3 (SOT1215)
DFN1110D-3 (SOT8015)
DFN1110D-3 (SOT8015)
Nexperia
SOT8015
plastic, leadless extremely thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.65
mm pitch; 1.1 mm x 1 mm x 0.48 mm body
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT8015
MO-340BA
sot8015_po
19-12-02
19-12-04
Unit
mm
max
nom
min
0.50 0.040
0.95
A
Dimensions (mm are the original dimensions)
Note
1. Side Wettable Flank, protrusion max. 0.02 mm.
2. Visible depend upon used manufacturing technology.
Dimension A and T are including plating thickness.
DFN1110D-3: plastic, leadless extremely thin small outline package with side-wettable flanks (SWF);
3 terminals; 0.65 mm pitch; 1.1 mm x 1 mm x 0.48 mm body
SOT8015
A1
b
0.30
D1
E
E1
e
0.65
0.25
0.020
0.47
e1
0.58
1.1
1
e2
0.19
0.90
0.43
0.23
0.05
0.16
K
L
0.27
T
0.05
y
0.05
u
0.05
w
0.1
v
0.44 0.005
0.87
0.48
0.40
0.22
0.10
D
0.22
0.20
0.2
0.09
(ref)
G
y1
0
scale
1 mm
X
D1
A
C
D
A
E
u C
B
detail X
Seating plane
A1
C
y
1
2
3
Gx45°
pin 1
index area
(1)
(1)
(1)
(1)
(1)
e
u C
(2)
(4x)
C
y1
b
(2x)
A
C
B
v
C
w
e2
K
T (3x)
L (2x)
(2x)
(2x)
E1
e1
Fig. 1. Package outline DFN1110D-3 (SOT8015)
SOT8015
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
4 December 2019
2 / 5
Nexperia
SOT8015
plastic, leadless extremely thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.65
mm pitch; 1.1 mm x 1 mm x 0.48 mm body
3. Soldering
SOT8015
Footprint information for reflow soldering of DFN1110D-3 package
0.2
0.3
0.4
0.8
0.9
1.0
1.8
0.6
0.5
0.4
0.88 0.78 0.68
0.34
0.22
0.44
sot8015_fr
occupied area
solder paste
solder resist
solder lands
Dimensions in mm
Issue date 19-11-27
0.34
0.34
0.12
0.45
1.4
0.2
0.35
0.3
0.25
0.65
recommended stencil thickness: 0.1 mm
Fig. 2. Reflow soldering footprint for DFN1110D-3 (SOT8015)
SOT8015
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
4 December 2019
3 / 5
Nexperia
SOT428C
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT428C
SC-63
TO-252
sot428c_po
19-08-28
Unit
mm
max
nom
min
2.38 0.93
1.10 5.46 0.60 6.22
4.57
1.0
A
Dimensions (mm are the original dimensions)
Note
1. Plastic body may have 45° chamfer.
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
SOT428C
A1
b
0.89
b1
b2
c
D1
D2
E
E1
e
2.285
e1
HD
L
2.95
L1
0.2
L2
w
6.47 4.45
4.0
9.6
2.22 0.46
0.72 5.00 0.20 5.98
0.5
0.71
2.55 0.5
6.73
10.4
0.2
y
0
5
10 mm
scale
A
2
1
3
E1
D2
D1
HD
L
L1
L2
e1
e
mounting
base
w
A
b
(2x)
E
b2
b1
(2x)
c
A1
y
A
see note 1
Fig. 1. Package outline DPAK (SOT428C)
SOT428C
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
23 October 2019
2 / 5
Nexperia
SOT8015
plastic, leadless extremely thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.65
mm pitch; 1.1 mm x 1 mm x 0.48 mm body
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT8015
MO-340BA
sot8015_po
19-12-02
19-12-04
Unit
mm
max
nom
min
0.50 0.040
0.95
A
Dimensions (mm are the original dimensions)
Note
1. Side Wettable Flank, protrusion max. 0.02 mm.
2. Visible depend upon used manufacturing technology.
Dimension A and T are including plating thickness.
DFN1110D-3: plastic, leadless extremely thin small outline package with side-wettable flanks (SWF);
3 terminals; 0.65 mm pitch; 1.1 mm x 1 mm x 0.48 mm body
SOT8015
A1
b
0.30
D1
E
E1
e
0.65
0.25
0.020
0.47
e1
0.58
1.1
1
e2
0.19
0.90
0.43
0.23
0.05
0.16
K
L
0.27
T
0.05
y
0.05
u
0.05
w
0.1
v
0.44 0.005
0.87
0.48
0.40
0.22
0.10
D
0.22
0.20
0.2
0.09
(ref)
G
y1
0
scale
1 mm
X
D1
A
C
D
A
E
u C
B
detail X
Seating plane
A1
C
y
1
2
3
Gx45°
pin 1
index area
(1)
(1)
(1)
(1)
(1)
e
u C
(2)
(4x)
C
y1
b
(2x)
A
C
B
v
C
w
e2
K
T (3x)
L (2x)
(2x)
(2x)
E1
e1
Fig. 1. Package outline DFN1110D-3 (SOT8015)
SOT8015
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
4 December 2019
2 / 5
Nexperia
SOT8015
plastic, leadless extremely thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.65
mm pitch; 1.1 mm x 1 mm x 0.48 mm body
3. Soldering
SOT8015
Footprint information for reflow soldering of DFN1110D-3 package
0.2
0.3
0.4
0.8
0.9
1.0
1.8
0.6
0.5
0.4
0.88 0.78 0.68
0.34
0.22
0.44
sot8015_fr
occupied area
solder paste
solder resist
solder lands
Dimensions in mm
Issue date 19-11-27
0.34
0.34
0.12
0.45
1.4
0.2
0.35
0.3
0.25
0.65
recommended stencil thickness: 0.1 mm
Fig. 2. Reflow soldering footprint for DFN1110D-3 (SOT8015)
SOT8015
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
4 December 2019
3 / 5



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