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PIC24FJ256GA705-I/M4. bảng dữ liệu(PDF) 382 Page - Microchip Technology

tên linh kiện PIC24FJ256GA705-I/M4.
Giải thích chi tiết về linh kiện  16-Bit General Purpose Microcontrollers with 256-Kbyte Flash and 16-Kbyte RAM in Low Pin Count Packages
PDF  412 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC24FJ256GA705-I/M4. bảng dữ liệu(HTML) 382 Page - Microchip Technology

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PIC24FJ256GA705 FAMILY
DS30010118B-page 382
 2016 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
2.00
2.00
MILLIMETERS
0.40 BSC
MIN
E
MAX
Contact Pad Length (X28)
Contact Pad Width (X28)
Y1
X1
0.85
0.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2333-M6 Rev B
NOM
28-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M6) - 4x4x0.6 mm Body [UQFN]
SILK SCREEN
1
2
28
C1
C2
E
X1
Y1
Y2
X2
C1
Contact Pad Spacing
3.90
Contact Pad to Center Pad (X28)
G1
0.52
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
ØV
EV
EV
G3
G1
X3
Y3
Corner Anchor Length (X4)
Corner Anchor Width (X4)
Y3
X3
0.78
0.78
3.90
With Corner Anchors
Contact Pad to Pad (X24)
G2
0.20
G2
Contact Pad to Corner Pad (X8)
G3
0.20



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