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STM32F429NEY6XXX bảng dữ liệu(PDF) 211 Page - STMicroelectronics

tên linh kiện STM32F429NEY6XXX
Giải thích chi tiết về linh kiện  ARM Cortex-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/2564KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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STM32F429NEY6XXX bảng dữ liệu(HTML) 211 Page - STMicroelectronics

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STM32F427xx STM32F429xx
Package information
225
Figure 96. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch
ball grid array recommended footprint
Note:
Non-solder mask defined (NSMD) pads are recommended.
Note:
4 to 6 mils solder paste screen printing process.
F
0.450
0.500
0.550
0.0177
0.0197
0.0217
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 117. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.27 mm
Dsm
0.35 mm typ. (depends on the soldermask
registration tolerance)
Solder paste
0.27 mm aperture diameter.
Table 116. UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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