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PIC18F258-E/LSQTP bảng dữ liệu(PDF) 385 Page - Microchip Technology

tên linh kiện PIC18F258-E/LSQTP
Giải thích chi tiết về linh kiện  28/40-Pin High-Performance, Enhanced Flash Microcontrollers with CAN Module
PDF  402 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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PIC18F258-E/LSQTP bảng dữ liệu(HTML) 385 Page - Microchip Technology

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© 2006 Microchip Technology Inc.
DS41159E-page 383
PIC18FXX8
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
F
A
A1
A2
α
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
CH x 45°
1.14
0.89
0.64
.045
.035
.025
CH
Pin 1 Corner Chamfer
1.00 REF.
.039 REF.
F
Footprint (Reference)
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
44
44
Pitch
p
.031
0.80
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Foot Angle
φ
03.5
7
0
3.5
7
Overall Width
E
.463
.472
.482
11.75
12.00
12.25
Overall Length
D
.463
.472
.482
11.75
12.00
12.25
Molded Package Width
E1
.390
.394
.398
9.90
10.00
10.10
Molded Package Length
D1
.390
.394
.398
9.90
10.00
10.10
Pins per Side
n1
11
11
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.012
.015
.017
0.30
0.38
0.44
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
JEDEC Equivalent: MS-026
Revised 07-22-05
* Controlling Parameter
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-076



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