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PIC18F258-E/LSQTP bảng dữ liệu(PDF) 337 Page - Microchip Technology |
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PIC18F258-E/LSQTP bảng dữ liệu(HTML) 337 Page - Microchip Technology |
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337 / 402 page ![]() © 2006 Microchip Technology Inc. DS41159E-page 335 PIC18FXX8 ΔIWDT Module Differential Current D022 Watchdog Timer PIC18LFXX8 — — — 0.75 0.8 7 1.5 8 25 μA μA μA VDD = 2.5V, +25 °C VDD = 2.0V, -40 °C to +85°C VDD = 4.2V, -40 °C to +85°C D022 Watchdog Timer PIC18FXX8 — — — 7 7 7 25 25 45 μA μA μA VDD = 4.2V, +25 °C VDD = 4.2V, -40 °C to +85°C VDD = 4.2V, -40 °C to +125°C D022A ΔIBOR Brown-out Reset(5) PIC18LFXX8 — — — 38 42 49 50 55 65 μA μA μA VDD = 2.0V, +25 °C VDD = 2.0V, -40 °C to +85°C VDD = 4.2V, -40 °C to +85°C D022A Brown-out Reset(5) PIC18FXX8 — — — 46 49 50 65 65 75 μA μA μA VDD = 4.2V, +25 °C VDD = 4.2V, -40 °C to +85°C VDD = 4.2V, -40 °C to +125°C D022B ΔILVD Low-Voltage Detect(5) PIC18LFXX8 — — — 36 40 47 50 55 65 μA μA μA VDD = 2.0V, +25 °C VDD = 2.0V, -40 °C to +85°C VDD = 4.2V, -40 °C to +85°C D022B Low-Voltage Detect(5) PIC18FXX8 — — — 44 47 47 65 65 75 μA μA μA VDD = 4.2V, +25 °C VDD = 4.2V, -40 °C to +85°C VDD = 4.2V, -40 °C to +125°C D025 ΔITMR1 Timer1 Oscillator PIC18LFXX8 — — — 6.2 6.2 7.5 40 45 55 μA μA μA VDD = 2.0V, +25 °C VDD = 2.0V, -40 °C to +85°C VDD = 4.2V, -40 °C to +85°C D025 Timer1 Oscillator PIC18FXX8 — — — 7.5 7.5 7.5 55 55 65 μA μA μA VDD = 4.2V, +25 °C VDD = 4.2V, -40 °C to +85°C VDD = 4.2V, -40 °C to +125°C 27.1 DC Characteristics (Continued) PIC18LFXX8 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FXX8 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Symbol Characteristic/ Device Min Typ Max Units Conditions Legend: Rows are shaded for improved readability. Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...). 4: For RC oscillator configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2 REXT (mA) with REXT in kOhm. 5: The LVD and BOR modules share a large portion of circuitry. The ΔIBOR and ΔILVD currents are not additive. Once one of these modules is enabled, the other may also be enabled without further penalty. |
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