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TXV0106-Q1 bảng dữ liệu(PDF) 16 Page - Texas Instruments |
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TXV0106-Q1 bảng dữ liệu(HTML) 16 Page - Texas Instruments |
16 / 24 page ![]() 9.4 Layout 9.4.1 Layout Guidelines For device reliability, follow common printed-circuit board layout guidelines such as the following: • Use short trace lengths to avoid excessive. • Use bypass capacitors on the power supply pins and place them as close to the device as possible. • A 0.1-µF bypass capacitor is recommended, but transient performance can be improved by having both 1-µF and 0.1-µF capacitors in parallel with the smallest value capacitor placed closest to the power pin. • The high drive capability of this device creates fast edges into light loads. Routing and load conditions should be considered to prevent ringing. 9.4.2 Layout Example Copper Traces Via to VCCB Via to VCCA Via to GND A B G Legend MAC PHY TXV0106-Q1 0.1µF 0201 15 14 13 12 11 10 2 3 4 5 6 7 Thermal Pad VCCA VCCB A1 A2 A3 A4 A5 A6 GND B1 B2 B3 B4 B5 B6 OE G G 0.1µF 0201 G G A B Figure 9-3. Layout Example – TXV0106-Q1 TXV0106-Q1 SCES956 – AUGUST 2023 www.ti.com 16 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TXV0106-Q1 |
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