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STM32G0 bảng dữ liệu(PDF) 130 Page - STMicroelectronics |
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STM32G0 bảng dữ liệu(HTML) 130 Page - STMicroelectronics |
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130 / 135 page ![]() STM32G071x8/xB 130/135 DS12232 Rev 4 6.9 Thermal characteristics The operating junction temperature TJ must never exceed the maximum given in The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is: TJ(max) = TA(max) + PD(max) x ΘJA where: • TA(max) is the maximum operating ambient temperature in °C, • ΘJA is the package junction-to-ambient thermal resistance, in °C/W, • PD = PINT + PI/O, –PINT is power dissipation contribution from product of IDD and VDD –PI/O is power dissipation contribution from output ports where: PI/O = Σ (VOL × IOL) + Σ ((VDDIO1 – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. 6.9.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (still air). Available from www.jedec.org. 6.9.2 Selecting the product temperature range The temperature range is specified in the ordering information scheme shown in Section 7: Ordering information. Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and to a specific maximum junction temperature. As applications do not commonly use microcontrollers at their maximum power consumption, it is useful to calculate the exact power consumption and junction temperature to determine which temperature range best suits the application. Table 21: General operating conditions. Table 84. Package thermal characteristics Symbol Parameter Package Value Unit ΘJA Thermal resistance junction-ambient LQFP64 10 × 10 mm 65 °C/W UFBGA64 5 × 5 mm 74 LQFP48 7 × 7 mm 75 UFQFPN48 7 × 7 mm 30 LQFP32 7 × 7 mm 76 UFQFPN32 5 × 5 mm 34 UFQFPN28 4 × 4 mm 44 WLCSP25 2.3 × 2.5 mm 70 |
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