STM32F732IE datasheet(209/226 Pages) STMICROELECTRONICS

209 / 226 page

DS11854 Rev 6

209/226

STM32F732xx STM32F733xx

Package information

222

1.350

1.400

1.450

0.0531

0.0551

0.0571

b(3)(4)

0.170

0.220

0.270

0.0067

0.0087

0.0106

b1(4)

0.170

0.200

0.230

0.0067

0.0079

0.0091

c(4)

0.090

0.200

0.0035

0.0079

c1(4)

0.090

0.160

0.0035

0.063

D(5)

26.000

1.0236

D1(6)(7)

24.000

0.9449

E(5)

26.000

0.0197

E1(6)(7)

24.000

0.9449

0.500

0.1970

0.450

0.600

0.750

0.0177

0.0236

0.0295

L1(4)

0.0394 REF

N(8)

176

0°

3.5°

7°

0°

3.5°

7°

θ1

0°

θ2

10°

12°

14°

10°

12°

14°

θ3

10°

12°

14°

10°

12°

14°

0.080

0.0031

0.080

0.200

0.0031

0.0079

0.200

0.0079

aaa(9)

0.200

0.0079

bbb(9)

0.200

0.0079

ccc(9)

0.080

0.0031

ddd(9)

0.080

0.0031

1. Values in inches are converted from mm and rounded to four decimal digits.

2. A1 is defined as the distance from the seating plane to the lowest point on the package body.

3. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead

width to exceed the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the

lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm

and 0.5 mm pitch packages.

4. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.

5. To be determined at seating datum plane C.

6. The Top package body size may be smaller than the bottom package size by as much as 0.15 mm.

7. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is

“0.25 mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch.

8. “N” is the max number of terminal positions for the specified body size.

9. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

Table 118. LQFP176 - Mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

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