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STM32H742VG bảng dữ liệu(PDF) 215 Page - STMicroelectronics |
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STM32H742VG bảng dữ liệu(HTML) 215 Page - STMicroelectronics |
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215 / 357 page ![]() DS12110 Rev 7 215/357 STM32H742xI/G STM32H743xI/G Electrical characteristics (rev V) 322 fCPU Arm® Cortex®-M7 clock frequency VOS3 - - 200 MHz VOS2 - - 300 VOS1 - - 400 VOS0 - - 480(5) fHCLK AHB clock frequency VOS3 - - 100 VOS2 - - 150 VOS1 - - 200 VOS0 - - 240(5) fPCLK APB clock frequency VOS3 - - 50(6) VOS2 - - 75 VOS1 - - 100 VOS0 - - 120(5) PD Power dissipation at TA = 85 °C for suffix 6(7) TFBGA240+25 - - 1093 mW LQFP208 - - 943 LQFP176 - - 930 UFBGA176+25 - - 1070 UFBGA169 - - 1061 LQFP144 - - 915 LQFP100 - - 889 TFBGA100 - - 1018 TA Ambient temperature for the suffix 6 version Maximum power dissipation –40 85 °C Low-power dissipation(8) –40 105 Ambient temperature for the suffix 3 version Maximum power dissipation –40 125 Low-power dissipation(5) –40 130 TJ Junction temperature range Suffix 6 version –40 125 °C 1. When RESET is released functionality is guaranteed down to VBOR0 min 2. This formula has to be applied on power supplies related to the IO structure described by the pin definition table. 3. For operation with voltage higher than Min (VDD, VDDA, VDD33USB) +0.3V, the internal Pull-up and Pull-Down resistors must be disabled. 4. VOS0 is available only when the LDO regulator is ON. 5. TJmax = 105 °C. 6. Maximum APB clock frequency when at least one peripheral is enabled. 7. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 8.9: Thermal characteristics). 8. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 8.9: Thermal characteristics). Table 122. General operating conditions (continued) Symbol Parameter Operating conditions Min Typ Max Unit |
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