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PIC18F4520E/MLQTP bảng dữ liệu(PDF) 332 Page - Microchip Technology

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Giải thích chi tiết về linh kiện  28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology
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PIC18F2420/2520/4420/4520
DS39631A-page 330
Preliminary
 2004 Microchip Technology Inc.
Supply Current (IDD)(2,3)
PIC18LFX42X/X52X
250
420
µA-40°C
FOSC = 1 MHZ
(PRI_RUN,
EC oscillator)
260
400
µA
+25°C
VDD = 2.0V
250
380
µA+85°C
PIC18LFX42X/X52X
550
740
µA-40°C
480
700
µA
+25°C
VDD = 3.0V
460
670
µA+85°C
All devices
1.2
1.6
mA
-40°C
1.1
1.5
mA
+25°C
VDD = 5.0V
1.0
1.4
mA
+85°C
PIC18LFX42X/X52X
0.72
1.6
mA
-40°C
FOSC = 4 MHz
(PRI_RUN,
EC oscillator)
0.74
1.5
mA
+25°C
VDD = 2.0V
0.74
1.4
mA
+85°C
PIC18LFX42X/X52X
1.3
2.6
mA
-40°C
1.3
2.5
mA
+25°C
VDD = 3.0V
1.3
2.4
mA
+85°C
All devices
2.7
4.7
mA
-40°C
2.6
4.5
mA
+25°C
VDD = 5.0V
2.5
4.3
mA
+85°C
All devices
15
26
mA
-40°C
FOSC = 40 MHZ
(PRI_RUN,
EC oscillator)
16
25
mA
+25°C
VDD = 4.2V
16
24
mA
+85°C
All devices
21
32
mA
-40°C
21
30
mA
+25°C
VDD = 5.0V
21
28
mA
+85°C
26.2
DC Characteristics: Power-Down and Supply Current
PIC18F2420/2520/4420/4520 (Industrial)
PIC18LF2420/2520/4420/4520 (Industrial) (Continued)
PIC18LFX42X/X52X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
PIC18FX42X/X52X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
ParamNo.
Device
Typ
Max
Units
Conditions
Legend:
Shading of rows is to assist in readability of the table.
Note 1:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2:
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3:
For RC oscillator configurations, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in k
Ω.
4:
Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
5:
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.



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