General Description
Combining Fairchilds advanced 2.5V specified PowerTrench® process with state of the art BGA packaging process, the FDZ493P minimizes both PCB space and rDS(on). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handing capability,ultra-low profile packaging, low gate charge, and low rDS(on).

Features
■ Max rDS(on) = 46mΩ at VGS = –4.5V, ID = –4.6A
■ Max rDS(on) = 72mΩ at VGS = –2.5V, ID = –3.6A
■ Occupies only 2.25 mm2 of PCB area. Less than 50% of the area of SSOT-6.
■ Ultra-thin package: less than 0.80 mm height when mounted to PCB.
■ Outstanding thermal transfer characteristics:4 times better than SSOT-6.
■ Ultra-low Qg x rDS(on) figure-of-merit.
■ RoHS Compliant.

Application
■ Battery management
■ Load switch
■ Battery protection