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ACCUTEK MICROCIRCUIT CO... |
AK16D300
|
79Kb / 3P |
Shrink Small Outline Package SSOP DIP Adapters
|
STMicroelectronics |
SSOP24
|
59Kb / 4P |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
National Semiconductor ... |
MTC16
|
70Kb / 1P |
16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16
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MSC16
|
24Kb / 1P |
MOLDED PACKAGE SSOP, EIAJ
|
Fujitsu Component Limit... |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|
National Semiconductor ... |
MC16A
|
53Kb / 1P |
16 Lead Ceramic Small Outline Package NS Package Number MC16A
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MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
STMicroelectronics |
TSSO20
|
57Kb / 4P |
20-LEAD THIN SHRINK SMALL OUTLINE
|
List of Unclassifed Man... |
40-05-015
|
25Kb / 1P |
Package Outline: 48 lead 300 mil SSOP
|