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Hello, Please ask a question about ATS-X50270P-C1-R0 Datasheet
# Example questions:
➢ How does the thermal resistance change when transitioning from unducted to ducted airflow at a velocity of 500 ft/min?
➢ What is the minimum lead time required to receive this product after placing an order?
➢ What are the typical dimensions of the bga components this heat sink is designed to cool?
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50270P-C1-R0
️· Dimensions:
- Length: 27 mm
- Width: 27 mm
- Height: 17.5 mm
- Fin Tip to Fin Tip: 48.4 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Designed for: 27 x 27 mm BGA components
## Features & Benefits
️· Space-Saving: Requires minimal space, ideal for densely populated PCBs.
️· Reworkable: Allows heat sink detachment and reattachment without component or PCB damage.
️· TIM Performance: Strong, uniform attachment force optimizes phase-changing TIM performance.
️· Holeless Mounting: Eliminates need for PCB mounting holes.
️· MaxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
️· Phase Change Material: Includes Chomerics T-766 (clean break, reworkable).
## Thermal Performance
️· Air Velocity & Thermal Resistance:
- 200 FT/MIN (1.0 m/s): 3.7 °C/W (unducted flow) / 2.9 °C/W (ducted flow)
- 300 FT/MIN (1.5 m/s): 3.0 °C/W (unducted flow) / 2.6 °C/W (ducted flow)
- 400 FT/MIN (2.0 m/s): 2.6 °C/W (unducted flow) / 2.3 °C/W (ducted flow)
- 500 FT/MIN (2.5 m/s): 2.3 °C/W (unducted flow) / 2.1 °C/W (ducted flow)
- 600 FT/MIN (3.0 m/s): 2.1 °C/W (unducted flow) / 1.9 °C/W (ducted flow)
- 700 FT/MIN (3.5 m/s): 2.0 °C/W (unducted flow)
- 800 FT/MIN (4.0 m/s): 1.9 °C/W (unducted flow)
## Notes & Ordering
️· Dimensions of the heat sink are subject to tolerances of up to .99 mm.
️· Thermal performance data are for reference only.
️· ATS reserves right to update product specifications.
️· Additional tooling fees and a lead time of 4-6 weeks may be required.
️· Contact ATS for custom options.
️· Website: www.qats.com
️· North America Phone: 781.769.2800
️· Europe Phone: +31 (0) 3569 84715
# High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
## Product Details
️· ATS Part #: ATS-X50270P-C1-R0
️· Dimensions:
- Length: 27 mm
- Width: 27 mm
- Height: 17.5 mm
- Fin Tip to Fin Tip: 48.4 mm
️· Material: Chomerics T766
️· Finish: Blue-Anodized
️· Designed for: 27 x 27 mm BGA components
## Features & Benefits
️· Space-Saving: Requires minimal space, ideal for densely populated PCBs.
️· Reworkable: Allows heat sink detachment and reattachment without component or PCB damage.
️· TIM Performance: Strong, uniform attachment force optimizes phase-changing TIM performance.
️· Holeless Mounting: Eliminates need for PCB mounting holes.
️· MaxiFLOW™ Heat Sink: Maximizes convection (air) cooling.
️· Phase Change Material: Includes Chomerics T-766 (clean break, reworkable).
## Thermal Performance
️· Air Velocity & Thermal Resistance:
- 200 FT/MIN (1.0 m/s): 3.7 °C/W (unducted flow) / 2.9 °C/W (ducted flow)
- 300 FT/MIN (1.5 m/s): 3.0 °C/W (unducted flow) / 2.6 °C/W (ducted flow)
- 400 FT/MIN (2.0 m/s): 2.6 °C/W (unducted flow) / 2.3 °C/W (ducted flow)
- 500 FT/MIN (2.5 m/s): 2.3 °C/W (unducted flow) / 2.1 °C/W (ducted flow)
- 600 FT/MIN (3.0 m/s): 2.1 °C/W (unducted flow) / 1.9 °C/W (ducted flow)
- 700 FT/MIN (3.5 m/s): 2.0 °C/W (unducted flow)
- 800 FT/MIN (4.0 m/s): 1.9 °C/W (unducted flow)
## Notes & Ordering
️· Dimensions of the heat sink are subject to tolerances of up to .99 mm.
️· Thermal performance data are for reference only.
️· ATS reserves right to update product specifications.
️· Additional tooling fees and a lead time of 4-6 weeks may be required.
️· Contact ATS for custom options.
️· Website: www.qats.com
️· North America Phone: 781.769.2800
️· Europe Phone: +31 (0) 3569 84715
| Part No. | ATS-X50270P-C1-R0 |
| Manufacturer | ATS |
| Size | 663 Kbytes |
| Pages | 1 page |
| Description | High Performance BGA Cooling |
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