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Hello, Please ask a question about BC635 Datasheet
# Example questions:
➢ What is the typical dc current gain (hfe) of the bc635 transistor when the collector current (ic) is 150ma?
➢ 02). what does 'δ' represent in this context?
➢ How does increasing the mounting pad area for the sot89 transistor affect its transient thermal impedance?
I. General Overview:
️· Product: BC635, BCP54, BCX54 NPN medium power transistors
️· Revision: Rev. 07 - June 2007
️· Page Numbers: Scattered across pages 6 to 10 of the datasheet.
️· Manufacturer: NXP Semiconductors.
️· Test Condition: T amb = 25 °C unless otherwise specified
II. Transient Thermal Impedance Graphs (Figures 1-9):
The majority of the content consists of graphs titled "Transient thermal impedance from junction to ambient as a function of pulse duration" (Figures 1-9). Here's a summary of what these graphs represent:
️· Variable: They plot the transient thermal impedance (how effectively heat is removed) versus time (pulse duration).
️· Dependency: The graphs show how the thermal impedance changes based on the "duty cycle" of the power pulses. Duty cycle is the proportion of time a signal is active or "on" compared to the total time.
️· Packaging & PCB Variations: The figures vary based on:
- SOT-xx Packages: Figures show graphs for SOT23, SOT323, and SOT89 packages.
- PCB Layout: The figures show variations based on the size of the mounting pad on the PCB (printed circuit board), specifically 1cm and 6cm.
️· Key Observations: Each graph shows a characteristic curve where the impedance is high initially, decreases over time as the transistor dissipates heat, and settles to a lower value.
III. Electrical Characteristics (Table 5):
This section contains a table summarizing the electrical characteristics of the transistors.
️· Symbol and Parameter: The table lists symbols (e.g., I CBO, h FE) representing various electrical parameters.
️· Conditions: It specifies the conditions under which each parameter is measured (e.g., voltage, current).
️· Range (Min/Typ/Max): It provides a range of values for each parameter, including minimum, typical, and maximum values.
Specific Parameter Highlights:
️· I CBO/I EBO: Collector and emitter cut-off current (very low leakage).
️· h FE (DC current gain): A measure of the transistor's amplification capability. There are multiple hFE values based on a selection parameter.
️· V CEsat: Collector-emitter saturation voltage (a measure of how low the voltage can be when the transistor is "on").
️· V BE: Base-emitter voltage.
️· C c: Collector capacitance.
️· f T: Transition frequency (related to the transistor's high-frequency performance).
️· Pulse Test: Some values are derived from pulse tests (short pulses with a small duty cycle) to avoid overheating.
IV. Other Notes:
️· The document uses notation common in electrical engineering (e.g., V for voltage, I for current, etc.).
️· The units are not always explicitly stated, but can be inferred from the context.
I. General Overview:
️· Product: BC635, BCP54, BCX54 NPN medium power transistors
️· Revision: Rev. 07 - June 2007
️· Page Numbers: Scattered across pages 6 to 10 of the datasheet.
️· Manufacturer: NXP Semiconductors.
️· Test Condition: T amb = 25 °C unless otherwise specified
II. Transient Thermal Impedance Graphs (Figures 1-9):
The majority of the content consists of graphs titled "Transient thermal impedance from junction to ambient as a function of pulse duration" (Figures 1-9). Here's a summary of what these graphs represent:
️· Variable: They plot the transient thermal impedance (how effectively heat is removed) versus time (pulse duration).
️· Dependency: The graphs show how the thermal impedance changes based on the "duty cycle" of the power pulses. Duty cycle is the proportion of time a signal is active or "on" compared to the total time.
️· Packaging & PCB Variations: The figures vary based on:
- SOT-xx Packages: Figures show graphs for SOT23, SOT323, and SOT89 packages.
- PCB Layout: The figures show variations based on the size of the mounting pad on the PCB (printed circuit board), specifically 1cm and 6cm.
️· Key Observations: Each graph shows a characteristic curve where the impedance is high initially, decreases over time as the transistor dissipates heat, and settles to a lower value.
III. Electrical Characteristics (Table 5):
This section contains a table summarizing the electrical characteristics of the transistors.
️· Symbol and Parameter: The table lists symbols (e.g., I CBO, h FE) representing various electrical parameters.
️· Conditions: It specifies the conditions under which each parameter is measured (e.g., voltage, current).
️· Range (Min/Typ/Max): It provides a range of values for each parameter, including minimum, typical, and maximum values.
Specific Parameter Highlights:
️· I CBO/I EBO: Collector and emitter cut-off current (very low leakage).
️· h FE (DC current gain): A measure of the transistor's amplification capability. There are multiple hFE values based on a selection parameter.
️· V CEsat: Collector-emitter saturation voltage (a measure of how low the voltage can be when the transistor is "on").
️· V BE: Base-emitter voltage.
️· C c: Collector capacitance.
️· f T: Transition frequency (related to the transistor's high-frequency performance).
️· Pulse Test: Some values are derived from pulse tests (short pulses with a small duty cycle) to avoid overheating.
IV. Other Notes:
️· The document uses notation common in electrical engineering (e.g., V for voltage, I for current, etc.).
️· The units are not always explicitly stated, but can be inferred from the context.
| Part No. | BC635 |
| Manufacturer | NXP |
| Size | 152 Kbytes |
| Pages | 15 pages |
| Description | 45 V, 1 A NPN medium power transistors |
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